Invention Grant
- Patent Title: Silicon based capacitive microphone
- Patent Title (中): 硅基电容麦克风
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Application No.: US12626835Application Date: 2009-11-27
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Publication No.: US08379881B2Publication Date: 2013-02-19
- Inventor: Zhi-Jiang Wu , Yong-Ze Su
- Applicant: Zhi-Jiang Wu , Yong-Ze Su
- Applicant Address: CN Shenzhen US CA La Verne
- Assignee: AAC Acoustic Technologies (Shenzhen) Co. Ltd.,American Audio Components Inc.
- Current Assignee: AAC Acoustic Technologies (Shenzhen) Co. Ltd.,American Audio Components Inc.
- Current Assignee Address: CN Shenzhen US CA La Verne
- Priority: CN200920131471U 20090515
- Main IPC: H04R3/00
- IPC: H04R3/00
Abstract:
A silicon based capacitive microphone includes a first printed circuit board, a second printed circuit board far away from the first printed circuit board, a transducer electrically mounted on the first printed circuit board, a controlling chip electrically mounted on the second printed circuit board, a connecting member located between the first and second printed circuit boards.
Public/Granted literature
- US20100290644A1 SILICON BASED CAPACITIVE MICROPHONE Public/Granted day:2010-11-18
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