Invention Grant
- Patent Title: Capacitive bonding of devices
- Patent Title (中): 器件电容性接合
-
Application No.: US13229608Application Date: 2011-09-09
-
Publication No.: US08380130B2Publication Date: 2013-02-19
- Inventor: Andrew C. Glass , Christopher M. Dreher , Ellick H. Sung , Randall E. Aull , Doron J. Holan , Craig S. Ranta
- Applicant: Andrew C. Glass , Christopher M. Dreher , Ellick H. Sung , Randall E. Aull , Doron J. Holan , Craig S. Ranta
- Applicant Address: US WA Redmond
- Assignee: Microsoft Corporation
- Current Assignee: Microsoft Corporation
- Current Assignee Address: US WA Redmond
- Agency: Wolfe-SBMC
- Main IPC: H04B7/00
- IPC: H04B7/00

Abstract:
Various embodiments relate to systems and methods that facilitate wireless device communications and configuration. A detection component identifies N devices that are coupled together via a biological medium, N being an integer, wherein the medium includes direct or indirect touching to a device or devices. After biological contact, a configuration component initiates a configuration between a subset of the devices.
Public/Granted literature
- US20110319019A1 CAPACITIVE BONDING OF DEVICES Public/Granted day:2011-12-29
Information query