Invention Grant
US08380337B2 Vacuum processing apparatus and vacuum transfer apparatus 有权
真空处理装置和真空传送装置

  • Patent Title: Vacuum processing apparatus and vacuum transfer apparatus
  • Patent Title (中): 真空处理装置和真空传送装置
  • Application No.: US12920145
    Application Date: 2009-12-16
  • Publication No.: US08380337B2
    Publication Date: 2013-02-19
  • Inventor: Tsutomu Hiroki
  • Applicant: Tsutomu Hiroki
  • Applicant Address: JP
  • Assignee: Tokyo Electron Limited
  • Current Assignee: Tokyo Electron Limited
  • Current Assignee Address: JP
  • Agency: Cantor Colburn LLP
  • Priority: JP2008-321942 20081218
  • International Application: PCT/JP2009/006919 WO 20091216
  • International Announcement: WO2010/070896 WO 20100624
  • Main IPC: G06F19/00
  • IPC: G06F19/00
Vacuum processing apparatus and vacuum transfer apparatus
Abstract:
Transfer capability is improved without having to extend a longitudinal space of a platform of a cluster tool downward. In a platform PF, a first transfer robot 16L includes a transfer main body 48L that is slidable on a left guide rail 46L, a transfer pedestal 50L that is slidable in an offset direction (X direction), and a slider type transfer arm 52L that is rotatable within a horizontal surface while being movable straight in a direction parallel to a radius of a rotation circle and supports one piece of a semiconductor wafer W. A second transfer robot 16R has the same configuration and operations as the first transfer robot 16L except that an operation or moving direction of each component of the second transfer robot 16R is vertically symmetrical to that of the first transfer robot 16L.
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