Invention Grant
US08380463B2 Apparatus having a modularly constructed, measuring transducer circuit 有权
具有模块化构造的测量传感器电路的装置

  • Patent Title: Apparatus having a modularly constructed, measuring transducer circuit
  • Patent Title (中): 具有模块化构造的测量传感器电路的装置
  • Application No.: US12312583
    Application Date: 2007-11-15
  • Publication No.: US08380463B2
    Publication Date: 2013-02-19
  • Inventor: Michael Philipps
  • Applicant: Michael Philipps
  • Applicant Address: DE Maulburg
  • Assignee: Endress + Hauser GmbH + Co. KG
  • Current Assignee: Endress + Hauser GmbH + Co. KG
  • Current Assignee Address: DE Maulburg
  • Agency: Bacon & Thomas, PLLC
  • Priority: DE102006054421 20061116; DE202006018584U 20061206
  • International Application: PCT/EP2007/062395 WO 20071115
  • International Announcement: WO2008/059019 WO 20080522
  • Main IPC: G06F15/00
  • IPC: G06F15/00 G01R15/00
Apparatus having a modularly constructed, measuring transducer circuit
Abstract:
An apparatus having at least one sensor for registering at least one chemical and/or physical, process variable, and at least one modularly constructed, measuring transducer circuit, which has at least one sensor unit, which ascertains a measured variable from the process variable registered by the sensor and supplies the sensor with energy as needed, and at least one application specific, signal processing unit for ascertaining a measured value of the measured variable, wherein a conditioned output signal is provided between the sensor unit and the application specific, signal processing unit, wherein the application specific, signal processing unit is exchangeably embodied, and wherein, as a function of a predeterminable accuracy of measurement with which the apparatus ascertains the measured values, a plurality of different types of application specific, signal processing units are provided.
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