Invention Grant
- Patent Title: Patch on interposer through PGA interconnect structures
- Patent Title (中): 通过PGA互连结构对内插器进行补丁
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Application No.: US12655406Application Date: 2009-12-30
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Publication No.: US08381393B2Publication Date: 2013-02-26
- Inventor: Brent M. Roberts , Mihir K. Roy , Sriram Srinivasan , Sridhar Narasimhan
- Applicant: Brent M. Roberts , Mihir K. Roy , Sriram Srinivasan , Sridhar Narasimhan
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Winkle, PLLC
- Main IPC: H01K3/10
- IPC: H01K3/10
Abstract:
Methods of forming a microelectronic structure are described. Embodiments of those methods include attaching a patch to an interposer, forming at least one interconnect structure above and on a top surface of the interposer; and attaching a flex connector to the at least one interconnect structure.
Public/Granted literature
- US20110157808A1 Patch on interposer through PGA interconnect structures Public/Granted day:2011-06-30
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