Invention Grant
- Patent Title: Modular building structure
- Patent Title (中): 模块化建筑结构
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Application No.: US12435234Application Date: 2009-05-04
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Publication No.: US08381468B2Publication Date: 2013-02-26
- Inventor: Kenneth J. Koupal
- Applicant: Kenneth J. Koupal
- Agency: Christie, Parker & Hale, LLP
- Main IPC: E04B1/38
- IPC: E04B1/38 ; E04C2/38

Abstract:
Modular building structures and systems for construction of modular buildings are provided. A modular building structure according to one embodiment includes at least two panels having two outer skins and an inner core; at least two panel spacers between the outer skins of the panels; at least two panel connectors partially receiving the panels; at least one coupling bar; and at least one corner coupler configured to couple two of the panels substantially perpendicular to each other. A modular building structure may further include at least one straight coupler configured to couple two of the panels substantially parallel to each other.
Public/Granted literature
- US20090272056A1 MODULAR BUILDING STRUCTURE Public/Granted day:2009-11-05
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