Invention Grant
- Patent Title: Compression-bonding apparatus
- Patent Title (中): 压接装置
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Application No.: US12818554Application Date: 2010-06-18
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Publication No.: US08381963B2Publication Date: 2013-02-26
- Inventor: Kimio Nakamura , Yoshiyuki Satoh , Kenji Kobae
- Applicant: Kimio Nakamura , Yoshiyuki Satoh , Kenji Kobae
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2009-149843 20090624
- Main IPC: B23K37/04
- IPC: B23K37/04 ; B29C65/02
Abstract:
A compression-bonding apparatus includes a support stage and a pressing tool. The pressing tool includes a pressing stage, an elastic member and a plurality of bonding heads. The elastic member is held by the pressing stage. The plurality of bonding heads includes an upper surface attached to the elastic member and a lower surface facing an upper surface of the support stage.
Public/Granted literature
- US20100327043A1 COMPRESSION-BONDING APPARATUS Public/Granted day:2010-12-30
Information query
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