Invention Grant
- Patent Title: Thermal compress bonding
- Patent Title (中): 热压接
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Application No.: US12841858Application Date: 2010-07-22
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Publication No.: US08381965B2Publication Date: 2013-02-26
- Inventor: Bor-Ping Jang , Kuei-Wei Huang , Wei-Hung Lin , Chung-Shi Liu
- Applicant: Bor-Ping Jang , Kuei-Wei Huang , Wei-Hung Lin , Chung-Shi Liu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: B23K31/02
- IPC: B23K31/02
Abstract:
A method includes providing a substrate carrier including work piece holders, and placing a first plurality of work pieces into the work piece holders. A second plurality of work pieces is picked up and placed, with each of the second plurality of work pieces being placed on one of the first plurality of work pieces. Solder bumps between the first and the second plurality of work pieces are then reflowed to simultaneously bond the first and the second plurality of work pieces together.
Public/Granted literature
- US20120018494A1 Thermal Compress Bonding Public/Granted day:2012-01-26
Information query
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