Invention Grant
US08382503B2 Quick release retention mechanism for socketed microelectronic devices
有权
用于插座微电子器件的快速释放保持机构
- Patent Title: Quick release retention mechanism for socketed microelectronic devices
- Patent Title (中): 用于插座微电子器件的快速释放保持机构
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Application No.: US12972101Application Date: 2010-12-17
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Publication No.: US08382503B2Publication Date: 2013-02-26
- Inventor: Aslam H. Haswarey , Mustafa H. Haswarey , Ridvan A. Sahan , Rahima K. Mohammed
- Applicant: Aslam H. Haswarey , Mustafa H. Haswarey , Ridvan A. Sahan , Rahima K. Mohammed
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Winkle, PLLC
- Main IPC: H01R13/62
- IPC: H01R13/62
Abstract:
The present description relates to the field of microelectronic device retention mechanisms and, more particularly, to a quick release retention mechanism including a base plate, a load plate and a biasing mechanism adapted to apply a desired load and to allow rapid insertion and extraction of microelectronic devices from sockets.
Public/Granted literature
- US20120156913A1 QUICK RELEASE RETENTION MECHANISM FOR SOCKETED MICROELECTRONIC DEVICES Public/Granted day:2012-06-21
Information query
