Invention Grant
- Patent Title: High density patch panel
- Patent Title (中): 高密度接线板
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Application No.: US12206837Application Date: 2008-09-09
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Publication No.: US08382515B2Publication Date: 2013-02-26
- Inventor: Jack E Caveney , Mark J Donnell
- Applicant: Jack E Caveney , Mark J Donnell
- Applicant Address: US IL Tinley Park
- Assignee: Panduit Corp.
- Current Assignee: Panduit Corp.
- Current Assignee Address: US IL Tinley Park
- Agent Robert A. McCann; Christopher S. Clancy; James H. Williams
- Main IPC: H01R13/60
- IPC: H01R13/60
Abstract:
A patch panel includes a frame, a faceplate mountable to the frame, and at least one modular jack mountable into a rear side of the faceplate. The frame has a top flange, a bottom flange, and a plurality of faceplate opening, and the faceplate is mountable within the top flange and the bottom flange, and has a plurality of mounting openings. Each mounting opening has at least one modular jack retention latch protruding within the mounting opening.
Public/Granted literature
- US20090004913A1 High Density Patch Panel Public/Granted day:2009-01-01
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