Invention Grant
- Patent Title: Electrical connector having thick film layers
- Patent Title (中): 具有厚膜层的电连接器
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Application No.: US13110215Application Date: 2011-05-18
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Publication No.: US08382524B2Publication Date: 2013-02-26
- Inventor: Leon Khilchenko , Mark W. Gailus
- Applicant: Leon Khilchenko , Mark W. Gailus
- Applicant Address: US CT Wallingford
- Assignee: Amphenol Corporation
- Current Assignee: Amphenol Corporation
- Current Assignee Address: US CT Wallingford
- Agency: Blank Rome LLP
- Main IPC: H01R13/66
- IPC: H01R13/66

Abstract:
An electrical connector electrically connects a first printed circuit board and a second printed circuit board, where the electrical connector includes: (a) an insulative housing; (b) a plurality of signal conductors, with at least a portion of each of the plurality of signal conductors disposed within the insulative housing; (c) each of the plurality of signal conductors having a first contact end, a second contact end and an intermediate portion therebetween; and (d) a passive circuit element electrically connected to the intermediate portion of each of the plurality of signal conductors, where the passive circuit element is housed in an insulative package and includes at least a capacitor or an inductor.
Public/Granted literature
- US20120094536A1 ELECTRICAL CONNECTOR HAVING THICK FILM LAYERS Public/Granted day:2012-04-19
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