Invention Grant
US08382900B2 Localized linear microwave source array pumping to control localized partial pressure in flat and 3 dimensional PECVD coatings
有权
局部线性微波源阵列泵浦，以控制平面和三维PECVD涂层中的局部分压
- Patent Title: Localized linear microwave source array pumping to control localized partial pressure in flat and 3 dimensional PECVD coatings
- Patent Title (中): 局部线性微波源阵列泵浦，以控制平面和三维PECVD涂层中的局部分压
-
Application No.: US12527281Application Date: 2007-02-15
-
Publication No.: US08382900B2Publication Date: 2013-02-26
- Inventor: Michael W. Stowell
- Applicant: Michael W. Stowell
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Cooley LLP
- International Application: PCT/US2007/062206 WO 20070215
- International Announcement: WO2008/100315 WO 20080821
- Main IPC: C23C16/00
- IPC: C23C16/00
Abstract:
A system and method for controlling deposition of thin films on substrates. One embodiment includes a vacuum chamber; a plurality of sources located inside the vacuum chamber; and a plurality of gas tubes, each of the plurality of gas tubes comprising a first volume for delivering precursor gas and a second volume for providing pumping.
Public/Granted literature
Information query
IPC分类:
