Invention Grant
- Patent Title: Dual cure adhesive formulations
- Patent Title (中): 双重固化胶粘剂配方
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Application No.: US13400774Application Date: 2012-02-21
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Publication No.: US08382929B2Publication Date: 2013-02-26
- Inventor: Mark W. Pressley
- Applicant: Mark W. Pressley
- Applicant Address: US NC Cary
- Assignee: Lord Corporation
- Current Assignee: Lord Corporation
- Current Assignee Address: US NC Cary
- Agent Todd W. Galinski
- Main IPC: B29C53/00
- IPC: B29C53/00 ; B29C53/04 ; C08J3/28 ; C08F2/46

Abstract:
An adhesive composition comprising as principal components, a polymerizable component, an ambient temperature radical polymerization catalyst system and a photoinitiator. The adhesive may optionally comprise an adhesion promoter, a toughener, an epoxy, and a filler material. Further, a two-part reactive adhesive comprising, a first part comprising, (i) at least one free radical-polymerizable monomer, (ii) at least one reducing agent, and (iii) a photoinitiator, and a second part comprising an oxidizing agent that is reactive at ambient temperature with the reducing agent to produce free radicals that are capable of initiating and propagating free radical polymerization.
Public/Granted literature
- US20120145312A1 DUAL CURE ADHESIVE FORMULATIONS Public/Granted day:2012-06-14
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