Invention Grant
- Patent Title: Molecular bonding method with cleaning with hydrofluoric acid in vapor phase and rinsing with deionized water
- Patent Title (中): 分子键合方法用氢氟酸在蒸气相中清洗并用去离子水冲洗
-
Application No.: US12068638Application Date: 2008-02-08
-
Publication No.: US08382933B2Publication Date: 2013-02-26
- Inventor: Frank Fournel , Hubert Moriceau , Christophe Morales , Pierre Perreau
- Applicant: Frank Fournel , Hubert Moriceau , Christophe Morales , Pierre Perreau
- Applicant Address: FR Paris
- Assignee: Commissariat a l'Energie Atomique
- Current Assignee: Commissariat a l'Energie Atomique
- Current Assignee Address: FR Paris
- Agency: Oliff & Berridge, PLC
- Priority: FR0701168 20070219
- Main IPC: B08B3/00
- IPC: B08B3/00 ; B29C65/00 ; B32B37/00 ; B32B38/00
Abstract:
Adhesion by molecular bonding of two free surfaces of first and second substrates, for example formed by monocrystalline silicon wafers, comprises at least successively: a cleaning step of the two free surfaces with hydrofluoric acid in vapor phase to make the two free surfaces hydrophobic, a rinsing step of said free surfaces with deionized water with a time less than or equal to 30 seconds a step of bringing said free surfaces into contact.
Public/Granted literature
Information query
