Invention Grant
- Patent Title: Manufacture of high strength, high density carrier plate
- Patent Title (中): 制造高强度，高密度的载板
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Application No.: US12389034Application Date: 2009-02-19
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Publication No.: US08383029B2Publication Date: 2013-02-26
- Inventor: Todd C. SeCoy , Dale S. Dougherty , Mikel S. Cole , Douglas J. Garcia , Michelle Wernert
- Applicant: Todd C. SeCoy , Dale S. Dougherty , Mikel S. Cole , Douglas J. Garcia , Michelle Wernert
- Applicant Address: US OR Portland
- Assignee: Electro Scientific Industries, Inc.
- Current Assignee: Electro Scientific Industries, Inc.
- Current Assignee Address: US OR Portland
- Agency: Young Basile
- Main IPC: B29C45/14
- IPC: B29C45/14
Abstract:
A carrier plate for supporting electronic components during processing includes hexagonally-arranged holes for supporting the components. Walls of the holes comprise a gripping resilient material. The hexagonal arrangement provides a strong carrier that improves production yield through an increase in per batch processing and improved locational accuracy over conventional carriers.
Public/Granted literature
- US20100206769A1 HIGH STRENGTH, HIGH DENSITY CARRIER PLATE Public/Granted day:2010-08-19
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