Invention Grant
- Patent Title: Microchip and microchip manufacturing method
- Patent Title (中): Microchip和微芯片制造方法
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Application No.: US13059370Application Date: 2009-08-10
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Publication No.: US08383063B2Publication Date: 2013-02-26
- Inventor: Hiroshi Hirayama , Toshinori Takimura
- Applicant: Hiroshi Hirayama , Toshinori Takimura
- Applicant Address: JP Tokyo
- Assignee: Konica Minolta Opto, Inc.
- Current Assignee: Konica Minolta Opto, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Cozen O'Connor
- Priority: JP2008-213572 20080822
- International Application: PCT/JP2009/064119 WO 20090810
- International Announcement: WO2010/021263 WO 20100225
- Main IPC: G01N15/06
- IPC: G01N15/06 ; G01N33/00 ; G01N33/48

Abstract:
A microchip 1 in which a resinous film can be inhibited from sagging into a channel. The microchip 1 comprises: a resinous substrate 2 having a channel groove formed therein; and a resinous film bonded to a surface of the substrate on which the channel groove has been formed. A micro-channel 3 including channels 3A and channels 3B is formed by the channel groove and the resinous film 10. The total length of the channels 3B, which is parallel to the X direction for the resinous substrate 2, is larger than the total length of the channels 3A, which is parallel to the Y direction for the resinous substrate 2. The resinous substrate 2 has been bonded to the resinous film so that the sides parallel to the channels 3B are parallel to the TD direction of the resinous film and that the sides parallel to the channels 3A are parallel to the MD direction of the resinous film.
Public/Granted literature
- US20110142716A1 Microchip and Process for Producing Microchip Public/Granted day:2011-06-16
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