Invention Grant
- Patent Title: Production method for laminated electronic component
- Patent Title (中): 层压电子部件的制造方法
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Application No.: US12485963Application Date: 2009-06-17
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Publication No.: US08383195B2Publication Date: 2013-02-26
- Inventor: Atsushi Sakanaka
- Applicant: Atsushi Sakanaka
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2008-173423 20080702
- Main IPC: B05D5/12
- IPC: B05D5/12 ; H01G7/00

Abstract:
In a production method for a laminated electronic component, a ceramic base body is formed by stacking a plurality of ceramic layers, and internal electrodes are formed in the ceramic base body. Lead-out portions of the internal electrodes are exposed from side surfaces of the ceramic base body. Belt-shaped external terminal electrodes are formed on the side surfaces by plating so as to be electrically connected to the exposed portions of the internal electrodes. The distance from an end surface to an external terminal electrode closest to the end surface in the ceramic base body is measured. When the measured distance does not correspond to a predetermined reference value, the ceramic base body is removed as being defective.
Public/Granted literature
- US20100003397A1 PRODUCTION METHOD FOR LAMINATED ELECTRONIC COMPONENT Public/Granted day:2010-01-07
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