An object of the present invention is to provide a flexible printed wiring board and multilayered flexible printed wiring board in which, in methods of laminating substrates comprising a non-adhering section and an adhering section, adhesion of the FPC substrates of the flexure part can be prevented and adequate flex resistance can be maintained.The present invention provides a flexible printed wiring board comprising at least an electric insulating layer and a conductor layer wherein the surface of the electric insulating layer has a 10-point average roughness of at least 1.5 μm and less than 2.0 μm and contact angle of at least 60° and less than 120°, or has a 10-point average roughness of at least 2.0 μm and less than 4.0 μm, and also provides a multilayered flexible printed wiring board formed by the lamination of two or more of the flexible printed wiring boards in which the surface of the electric insulating layers of the two or more flexible printed wiring boards exposed in a bendable state are opposing in a non-adhered state, and a part of the wiring boards is laminated on each of a first multilayered flexible printed wiring board and a second multilayered flexible printed wiring board.