Invention Grant
- Patent Title: Method and apparatus for thermal treatment of semiconductor workpieces
- Patent Title (中): 半导体工件热处理方法和装置
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Application No.: US12733436Application Date: 2007-08-29
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Publication No.: US08383429B2Publication Date: 2013-02-26
- Inventor: Yue Ma , Chuan He , Zhenxu Pang , David Wang , Voha Nuch
- Applicant: Yue Ma , Chuan He , Zhenxu Pang , David Wang , Voha Nuch
- Applicant Address: CN
- Assignee: ACM Research (Shanghai) Inc.
- Current Assignee: ACM Research (Shanghai) Inc.
- Current Assignee Address: CN
- Agent Howard C. Miskin; Gloria Tsui-Yip
- International Application: PCT/CN2007/070582 WO 20070829
- International Announcement: WO2009/026765 WO 20090305
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
The present invention provides an apparatus and method for rapid and uniform thermal treatment of semiconductor workpieces in two closely arranged thermal treatment chambers with a retractable door between them. The retractable door moves in between two thermal treatment chambers during heating or cooling process, and additional heating and cooling sources are provided for double-side thermal treatment of the semiconductor workpiece.
Public/Granted literature
- US20100240226A1 METHOD AND APPARATUS FOR THERMAL TREATMENT OF SEMICONDUCTOR WORKPIECES Public/Granted day:2010-09-23
Information query
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