Invention Grant
- Patent Title: Semiconductor package having an antenna with reduced area and method for fabricating the same
- Patent Title (中): 具有减小面积的天线的半导体封装及其制造方法
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Application No.: US13186713Application Date: 2011-07-20
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Publication No.: US08383463B2Publication Date: 2013-02-26
- Inventor: Tae Min Kang
- Applicant: Tae Min Kang
- Applicant Address: KR Gyeonggi-do
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Ladas & Parry LLP
- Priority: KR10-2008-0125466 20081210; KR10-2009-0053185 20090616
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A semiconductor package includes an electromagnetic shielding member for shielding electromagnetic waves. An antenna is disposed on an upper face of the electromagnetic shielding member and includes an antenna part with a plurality of conductive particles electrically connected with each other and an insulation part disposed on the upper face of the electromagnetic shielding member and insulating the antenna part. Ball lands are disposed on the electromagnetic shielding member and are electrically connected with the antenna part. A Radio Frequency Identification (RFID) chip is electrically connected to the ball lands.
Public/Granted literature
- US20110275181A1 SEMICONDUCTOR PACKAGE HAVING AN ANTENNA WITH REDUCED AREA AND METHOD FOR FABRICATING THE SAME Public/Granted day:2011-11-10
Information query
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