Invention Grant
- Patent Title: High performance CMOS circuits, and methods for fabricating same
- Patent Title (中): 高性能CMOS电路及其制造方法
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Application No.: US12541562Application Date: 2009-08-14
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Publication No.: US08383483B2Publication Date: 2013-02-26
- Inventor: John C. Arnold , Glenn A. Biery , Alessandro C. Callegari , Tze-Chiang Chen , Michael P. Chudzik , Bruce B. Doris , Michael A. Gribelyuk , Young-Hee Kim , Barry P. Linder , Vijay Narayanan , Joseph S. Newbury , Vamsi K. Paruchuri , Michelle L. Steen
- Applicant: John C. Arnold , Glenn A. Biery , Alessandro C. Callegari , Tze-Chiang Chen , Michael P. Chudzik , Bruce B. Doris , Michael A. Gribelyuk , Young-Hee Kim , Barry P. Linder , Vijay Narayanan , Joseph S. Newbury , Vamsi K. Paruchuri , Michelle L. Steen
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Louis J. Percello, Esq.
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
The present invention relates to complementary metal-oxide-semiconductor (CMOS) circuits that each contains at least a first and a second gate stacks. The first gate stack is located over a first device region (e.g., an n-FET device region) in a semiconductor substrate and comprises at least, from bottom to top, a gate dielectric layer, a metallic gate conductor, and a silicon-containing gate conductor. The second gate stack is located over a second device region (e.g., a p-FET device region) in the semiconductor substrate and comprises at least, from bottom to top, a gate dielectric layer and a silicon-containing gate conductor. The first and second gate stacks can be formed over the semiconductor substrate in an integrated manner by various methods of the present invention.
Public/Granted literature
- US20100041221A1 HIGH PERFORMANCE CMOS CIRCUITS, AND METHODS FOR FABRICATING SAME Public/Granted day:2010-02-18
Information query
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