Invention Grant
US08383499B2 Method for forming gallium nitride semiconductor device with improved forward conduction
有权
用于形成具有改善的正向传导的氮化镓半导体器件的方法
- Patent Title: Method for forming gallium nitride semiconductor device with improved forward conduction
- Patent Title (中): 用于形成具有改善的正向传导的氮化镓半导体器件的方法
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Application No.: US13553237Application Date: 2012-07-19
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Publication No.: US08383499B2Publication Date: 2013-02-26
- Inventor: TingGang Zhu
- Applicant: TingGang Zhu
- Applicant Address: US CA Sunnyvale
- Assignee: Alpha and Omega Semiconductor Incorporated
- Current Assignee: Alpha and Omega Semiconductor Incorporated
- Current Assignee Address: US CA Sunnyvale
- Agency: Van Pelt, Yi & James LLP
- Main IPC: H01L21/28
- IPC: H01L21/28 ; H01L21/44

Abstract:
A method for forming a gallium nitride based semiconductor diode includes forming Schottky contacts on the upper surface of mesas formed in a semiconductor body formed on a substrate. Ohmic contacts are formed on the lower surface of the semiconductor body. In one embodiment, an insulating layer is formed over the Schottky and ohmic contacts and vias are formed in the insulating layer to the Schottky and ohmic contacts to form the anode and cathode electrodes. In another embodiment, vias are formed in the insulating layer to the Schottky contacts and vias are formed in the semiconductor body to the ohmic contacts. An anode electrode is formed in electrical contact with the Schottky contacts. A cathode electrode is formed in electrical contact with the ohmic contacts on the backside of the substrate.
Public/Granted literature
- US20120282762A1 Method For Forming Gallium Nitride Semiconductor Device With Improved Forward Conduction Public/Granted day:2012-11-08
Information query
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