Invention Grant
US08383738B2 Epoxy resin composition, and prepreg and printed circuit board using the same
有权
环氧树脂组合物，以及使用其的预浸料和印刷电路板
- Patent Title: Epoxy resin composition, and prepreg and printed circuit board using the same
- Patent Title (中): 环氧树脂组合物，以及使用其的预浸料和印刷电路板
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Application No.: US12842653Application Date: 2010-07-23
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Publication No.: US08383738B2Publication Date: 2013-02-26
- Inventor: Hsien-Te Chen , Tsung-Hsien Lin
- Applicant: Hsien-Te Chen , Tsung-Hsien Lin
- Applicant Address: TW Jhubei, Hsinchu County
- Assignee: Taiwan Union Technology Corporation
- Current Assignee: Taiwan Union Technology Corporation
- Current Assignee Address: TW Jhubei, Hsinchu County
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Priority: TW99119330A 20100614
- Main IPC: B32B17/04
- IPC: B32B17/04 ; B32B27/04 ; C08L63/00 ; H05K1/03
Abstract:
Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin; (B) a composite curing agent, including amino-triazine-novolac resin, diaminodiphenylsulfone, and dicyandiamide mixed in a certain proportion; (C) a curing accelerator; and (D) an optional inorganic filler.
Public/Granted literature
- US20110303446A1 EPOXY RESIN COMPOSITION, AND PREPREG AND PRINTED CIRCUIT BOARD USING THE SAME Public/Granted day:2011-12-15
Information query
