Invention Grant
- Patent Title: Grounding mechanism for slide-type electronic devices
- Patent Title (中): 滑动型电子设备的接地机构
-
Application No.: US12844982Application Date: 2010-07-28
-
Publication No.: US08383936B2Publication Date: 2013-02-26
- Inventor: Chao Duan , Chia-Hua Chen
- Applicant: Chao Duan , Chia-Hua Chen
- Applicant Address: CN Shenzhen HK Kowloon
- Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee Address: CN Shenzhen HK Kowloon
- Agency: Altis Law Group, Inc.
- Priority: CN201010158502 20100428
- Main IPC: H05K5/02
- IPC: H05K5/02
Abstract:
A grounding mechanism is used for a slidable electronic device including a first housing, a second housing, a conductive member and a grounding tab. The grounding tab is for attachment to the first housing. The receiving portion is formed in the second housing. The conductive member is attached to the receiving portion. The grounding tab contacts the conductive member, the first housing is electrically connected to the second housing.
Public/Granted literature
- US20110266020A1 GROUNDING MECHANISM FOR SLIDE-TYPE ELECTRONIC DEVICES Public/Granted day:2011-11-03
Information query
