A metal fitting integration type stress-relief cone is provided with a stress-relief cone which includes a cylindrical rubber-like elastic body on an outer circumference of a cable core and a metal fitting which surrounds the cable core and is integral with a low-voltage side of the stress-relief cone. The stress-relief cone is provided with a cylindrical semi-conducting body part at the low-voltage side and has a bell-mouthed electric-field stress-control part in an end of a high-voltage side, an insulating body part on the high-voltage side with a low-voltage side end concentric with the semi-conducting body part and a cylindrical insulation protective layer which is arranged continuously at the end of the low-voltage side of the insulating body part and is integral with the outer circumference of the semi-conducting body part.