Invention Grant
- Patent Title: Flex-rigid wiring board and method for manufacturing the same
- Patent Title (中): 挠性刚性接线板及其制造方法
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Application No.: US12794106Application Date: 2010-06-04
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Publication No.: US08383948B2Publication Date: 2013-02-26
- Inventor: Masakazu Aoyama , Teruyuki Ishihara , Noboru Shibita
- Applicant: Masakazu Aoyama , Teruyuki Ishihara , Noboru Shibita
- Applicant Address: JP Ogaki-shi
- Assignee: Ibiden Co., Ltd.
- Current Assignee: Ibiden Co., Ltd.
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
A flex-rigid wiring board includes a flexible substrate having a first surface and a second surface on the opposite side of the first surface, a first conductive pattern formed on the first surface of the flexible substrate, a second conductive pattern formed on the second surface of the flexible substrate, and a conductor made of a conductive paste and formed in a first hole penetrating through the flexible substrate such that the first conductive pattern and the second conductive pattern are electrically connected to each other.
Public/Granted literature
- US20110067904A1 FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2011-03-24
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