Invention Grant
- Patent Title: Printed circuit board
- Patent Title (中): 印刷电路板
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Application No.: US12875156Application Date: 2010-09-03
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Publication No.: US08383957B2Publication Date: 2013-02-26
- Inventor: Shou-Kuo Hsu , Yung-Chieh Chen , Hsien-Chuan Liang , Wen-Laing Tseng , Shen-Chun Li , Chia-Nan Pai
- Applicant: Shou-Kuo Hsu , Yung-Chieh Chen , Hsien-Chuan Liang , Wen-Laing Tseng , Shen-Chun Li , Chia-Nan Pai
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: TW99128175A 20100824
- Main IPC: H05K1/11
- IPC: H05K1/11

Abstract:
A printed circuit board (PCB) includes two layers, two signal transmission traces, and a vertical interconnect access (via). The signal transmission traces are respectively arranged on the layers. The signal transmission traces are electrically connected to each other through the via. A centerline of the via with a vertical line of the layers form an acute angle θ, the angle θ is less than cos−1[(Lv2−Lt2)/(Lv2+Lt2)]. Wherein Lt is loss of the two signal transmitting traces in a unit length, and Lv is loss of the via in a unit length.
Public/Granted literature
- US20120048610A1 PRINTED CIRCUIT BOARD Public/Granted day:2012-03-01
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