Invention Grant
- Patent Title: Substrate transport apparatus and heat treatment apparatus
- Patent Title (中): 基板输送装置及热处理装置
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Application No.: US12045986Application Date: 2008-03-11
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Publication No.: US08383990B2Publication Date: 2013-02-26
- Inventor: Akihiko Morita , Kenichi Oyama , Koji Nishi
- Applicant: Akihiko Morita , Kenichi Oyama , Koji Nishi
- Applicant Address: JP Kyoto
- Assignee: Sokudo Co., Ltd.
- Current Assignee: Sokudo Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: JP2007-072351 20070320
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H05B1/02 ; H05B3/22 ; F27B5/12 ; F27B5/14

Abstract:
A chilled arm that transports a substrate to and from a heating plate for performing a heating process on the substrate is formed with a flow passage pipe therein, and cools the entire holding area thereof opposed to the substrate held by the chilled arm to a predetermined reference temperature by supplying circulating cooling water through the flow passage pipe. Six polyimide heaters are affixed to the holding area to control the temperature of at least a portion of the holding area at a temperature different from the reference temperature. These two temperature control mechanisms intentionally provide a temperature distribution to the holding area to thereby provide an intentional temperature distribution to the substrate before and after the heat treatment by the heating plate. This reduces the nonuniformity of a temperature distribution which typically occurs in the heating plate to accomplish a uniform heat treatment throughout the heat treatment process step.
Public/Granted literature
- US20090060686A1 SUBSTRATE TRANSPORT APPARATUS AND HEAT TREATMENT APPARATUS Public/Granted day:2009-03-05
Information query
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