Invention Grant
- Patent Title: Heated planar element and method for its attachment
- Patent Title (中): 加热平面元件及其附件的方法
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Application No.: US12640703Application Date: 2009-12-17
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Publication No.: US08383997B2Publication Date: 2013-02-26
- Inventor: Klaus Keite-Telgenbüscher , Monika Junghans , Bernd Dietz , Udo Dominikat , Frank Domann , Ute Ellringmann
- Applicant: Klaus Keite-Telgenbüscher , Monika Junghans , Bernd Dietz , Udo Dominikat , Frank Domann , Ute Ellringmann
- Applicant Address: DE Hamburg
- Assignee: tesa SE
- Current Assignee: tesa SE
- Current Assignee Address: DE Hamburg
- Agency: Norris, McLaughlin & Marcus, P.A.
- Priority: DE102008063849 20081219
- Main IPC: H05B3/02
- IPC: H05B3/02 ; B29C65/52

Abstract:
A double-sidedly bondable planar element which has an electrical contacting layer via which it is self-regulatingly intrinsically heatable and at the same time has a high flexibility. The particular features of this planar element are that the planar element in the storage condition is adhesive on one side only, and is therefore particularly easy to handle, and that, on bonding, the adhesive passes through cutouts in the contacting layer, and the planar element thus becomes double-sidedly bondable. The invention further provides a method for the bonding of this planar element, including as a key step the passage of the adhesive through the cutouts in the contacting layer, thus turning a single-sidedly adhesive planar element into a double-sidedly adhesive planar element.
Public/Granted literature
- US20100170889A1 Heated planar element and method for its attachment Public/Granted day:2010-07-08
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