Invention Grant
- Patent Title: Electron beam lithography apparatus and electron beam lithography method
- Patent Title (中): 电子束光刻设备和电子束光刻法
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Application No.: US12927180Application Date: 2010-11-09
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Publication No.: US08384052B2Publication Date: 2013-02-26
- Inventor: Akio Yamada , Masaki Kurokawa
- Applicant: Akio Yamada , Masaki Kurokawa
- Applicant Address: JP Tokyo
- Assignee: Advantest Corp.
- Current Assignee: Advantest Corp.
- Current Assignee Address: JP Tokyo
- Agency: Muramatsu & Associates
- Main IPC: H01L21/027
- IPC: H01L21/027

Abstract:
An electron beam lithography apparatus includes an electron gun emitting an electron beam, a deflector deflecting the electron beam, a focus corrector correcting a focus of the electron beam, a storage unit storing exposure data, and a controller correcting the exposure data based on a constant correction coefficient independent of time passage and a fluctuating correction coefficient changing with time, calculates a deflection efficiency indicating a relation between an input signal to the deflector and an amount of beam deflection, and a correction intensity indicating a relation between an input signal to the focus corrector and a beam focus, and writes the electron beam on a sample according to the deflection efficiency and the correction intensity.
Public/Granted literature
- US20110057114A1 Electron beam lithography apparatus and electron beam lithography method Public/Granted day:2011-03-10
Information query
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