Invention Grant
US08384099B2 GaN based LED having reduced thickness and method for making the same
失效
具有减小厚度的GaN基LED及其制造方法
- Patent Title: GaN based LED having reduced thickness and method for making the same
- Patent Title (中): 具有减小厚度的GaN基LED及其制造方法
-
Application No.: US12860162Application Date: 2010-08-20
-
Publication No.: US08384099B2Publication Date: 2013-02-26
- Inventor: Steven D. Lester , Frank T. Shum
- Applicant: Steven D. Lester , Frank T. Shum
- Applicant Address: US CA Livermore
- Assignee: Bridgelux, Inc.
- Current Assignee: Bridgelux, Inc.
- Current Assignee Address: US CA Livermore
- Agent Calvin B. Ward
- Main IPC: H01L29/206
- IPC: H01L29/206

Abstract:
A device having a carrier, a light-emitting structure, and first and second electrodes is disclosed. The light-emitting structure includes an active layer sandwiched between a p-type GaN layer and an n-type GaN layer, the active layer emitting light of a predetermined wavelength in the active layer when electrons and holes from the n-type GaN layer and the p-type GaN layer, respectively, combine therein. The first and second electrodes are bonded to the surfaces of the p-type and n-type GaN layers that are not adjacent to the active layer. The n-type GaN layer has a thickness less than 1.25 μm. The carrier is bonded to the light emitting structure during the thinning of the n-type GaN layer. The thinned light-emitting structure can be transferred to a second carrier to provide a device that is analogous to conventional LEDs having contacts on the top surface of the LED.
Public/Granted literature
- US20120032183A1 GaN Based LED having Reduced Thickness and Method for Making the Same Public/Granted day:2012-02-09
Information query