Invention Grant
- Patent Title: Light emitting diodes with enhanced thermal sinking and associated methods of operation
- Patent Title (中): 具有增强的散热和相关操作方法的发光二极管
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Application No.: US12727943Application Date: 2010-03-19
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Publication No.: US08384105B2Publication Date: 2013-02-26
- Inventor: Kevin Tetz , Charles M. Watkins
- Applicant: Kevin Tetz , Charles M. Watkins
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
Solid state lighting devices and associated methods of thermal sinking are described below. In one embodiment, a light emitting diode (LED) device includes a heat sink, an LED die thermally coupled to the heat sink, and a phosphor spaced apart from the LED die. The LED device also includes a heat conduction path in direct contact with both the phosphor and the heat sink. The heat conduction path is configured to conduct heat from the phosphor to the heat sink.
Public/Granted literature
- US20110227108A1 LIGHT EMITTING DIODES WITH ENHANCED THERMAL SINKING AND ASSOCIATED METHODS OF OPERATION Public/Granted day:2011-09-22
Information query
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