Invention Grant
US08384106B2 Light emitting device and light emitting device package having the same 有权
发光器件和具有该发光器件的发光器件封装

  • Patent Title: Light emitting device and light emitting device package having the same
  • Patent Title (中): 发光器件和具有该发光器件的发光器件封装
  • Application No.: US12783741
    Application Date: 2010-05-20
  • Publication No.: US08384106B2
    Publication Date: 2013-02-26
  • Inventor: Woo Sik Lim
  • Applicant: Woo Sik Lim
  • Applicant Address: KR Seoul
  • Assignee: LG Innotek Co., Ltd.
  • Current Assignee: LG Innotek Co., Ltd.
  • Current Assignee Address: KR Seoul
  • Agency: Ked & Associates LLP
  • Priority: KR10-2009-0044291 20090521
  • Main IPC: H01L33/00
  • IPC: H01L33/00
Light emitting device and light emitting device package having the same
Abstract:
A light emitting device may comprise a first semiconductor layer having a first and second surfaces, the first and second surfaces being opposite surfaces, the first semiconductor layer having a plurality of semiconductor columns extending from the second surface, the plurality of semiconductor columns being separated from each other; a light emitting structure formed over the first semiconductor layer, the light emitting structure including a first conductive semiconductor layer, an active layer and a second semiconductor layer, the light emitting structure having a side surface and an exposed side surface of a semiconductor column closest to the side surface of the light emitting structure being non-aligned with the side surface of the light emitting structure; and a substrate provided adjacent to the plurality of semiconductor columns.
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