Invention Grant
- Patent Title: Light emitting chip
- Patent Title (中): 发光芯片
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Application No.: US13283610Application Date: 2011-10-28
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Publication No.: US08384112B2Publication Date: 2013-02-26
- Inventor: Jian-Shihn Tsang
- Applicant: Jian-Shihn Tsang
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: TW100109631A 20110322
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
A light emitting chip includes a substrate, a reflective layer, a light emitting structure and a first electrode having a base formed between the reflective layer and the substrate. The light emitting structure includes a first semiconductor layer, an active layer and a second semiconductor layer. The first electrode further includes a connecting section extending upwardly from the base. An electrically insulating ion region is defined in the light emitting structure and extends from an upper surface of the base to the first semiconductor layer. A receiving groove is defined in the ion region and extends upwardly from the upper surface of the base to the first semiconductor layer. The connecting section is positioned in the receiving groove and electrically connects with the first semiconductor layer.
Public/Granted literature
- US20120241724A1 LIGHT EMITTING CHIP Public/Granted day:2012-09-27
Information query
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