Invention Grant
- Patent Title: Electronic devices with yielding substrates
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Application No.: US13171973Application Date: 2011-06-29
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Publication No.: US08384121B2Publication Date: 2013-02-26
- Inventor: Michael Tischler , Philippe Schick , Ian Ashdown , Calvin Wade Sheen , Paul Jungwirth
- Applicant: Michael Tischler , Philippe Schick , Ian Ashdown , Calvin Wade Sheen , Paul Jungwirth
- Applicant Address: CA British Columbia
- Assignee: Cooledge Lighting Inc.
- Current Assignee: Cooledge Lighting Inc.
- Current Assignee Address: CA British Columbia
- Agency: Bingham McCutchen LLP
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L21/00
Abstract:
In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
Public/Granted literature
- US20110315956A1 Electronic Devices with Yielding Substrates Public/Granted day:2011-12-29
Information query
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