Invention Grant
- Patent Title: System for separation of an electrically conductive connection
- Patent Title (中): 用于分离导电连接的系统
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Application No.: US12853955Application Date: 2010-08-10
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Publication No.: US08384132B2Publication Date: 2013-02-26
- Inventor: Guenther Ruhl , Markus Hammer , Regina Kainzbauer
- Applicant: Guenther Ruhl , Markus Hammer , Regina Kainzbauer
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Priority: DE102006046790 20061002
- Main IPC: H01L23/52
- IPC: H01L23/52
Abstract:
An integrated component includes a semiconductor substrate; at least one interconnect applied on the semiconductor substrate; an insulating layer applied on the at least one interconnect; and at least one opening through the insulating layer which interrupts the at least one interconnect into a first section and a second section.
Public/Granted literature
- US20100320460A1 SYSTEM FOR SEPARATION OF AN ELECTRICALLY CONDUCTIVE CONNECTION Public/Granted day:2010-12-23
Information query
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