An interconnect structure includes a substrate, a first diffusion region within the substrate, a plurality of first lines on the substrate and the first diffusion region, a first enclosure coupled to an end of the plurality of first lines, and a first contact within the first enclosure. The interconnect structure further includes a second diffusion region within the substrate, a plurality of second lines on the substrate and the second diffusion region, a second enclosure coupled to an end of the plurality of second lines, and a second contact within the second enclosure. A spacing can be present between the plurality of first lines and the plurality of second lines. The plurality of first lines, the first contact, the plurality of second lines, and the second contact are trimmed, but the first enclosure, the second enclosure, and the spacing are not trimmed.