Invention Grant
US08384173B2 Solid-state imaging device and method for making the same, and imaging apparatus 有权
固态成像装置及其制造方法以及成像装置

  • Patent Title: Solid-state imaging device and method for making the same, and imaging apparatus
  • Patent Title (中): 固态成像装置及其制造方法以及成像装置
  • Application No.: US12783227
    Application Date: 2010-05-19
  • Publication No.: US08384173B2
    Publication Date: 2013-02-26
  • Inventor: Hiroyasu Matsugai
  • Applicant: Hiroyasu Matsugai
  • Applicant Address: JP Tokyo
  • Assignee: Sony Corporation
  • Current Assignee: Sony Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: SNR Denton US LLP
  • Priority: JP2009-139352 20090610
  • Main IPC: H01L31/0232
  • IPC: H01L31/0232
Solid-state imaging device and method for making the same, and imaging apparatus
Abstract:
A solid-state imaging device includes a light receiving unit formed in a semiconductor base and configured to perform photoelectric conversion; an insulating layer disposed on the semiconductor base; a film constituting a cladding of a waveguide together with the insulating layer and being formed in an outer part of an interior of a hole by coating, the hole being formed in the insulating layer above the light receiving unit; a core of the waveguide, the core being composed of a material having a higher refractive index than a material for the insulating layer and a material for the film formed by coating, the core being formed in an inner part of the interior of the hole; and an inner lens integrated with the waveguide, the inner lens having a lens surface formed at the bottom of the hole at the interface between the film formed by coating and the core.
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