Invention Grant
- Patent Title: Folded system-in-package with heat spreader
- Patent Title (中): 带散热器的折叠系统级封装
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Application No.: US12831033Application Date: 2010-07-06
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Publication No.: US08385073B2Publication Date: 2013-02-26
- Inventor: Samuel Tam , Younes Shabany
- Applicant: Samuel Tam , Younes Shabany
- Applicant Address: US CO Broomfield
- Assignee: Flextronics AP, LLC
- Current Assignee: Flextronics AP, LLC
- Current Assignee Address: US CO Broomfield
- Agency: Marsh Fischmann & Breyfogle LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K3/36

Abstract:
A folded system-in-package (SiP) assembly is provided for minimizing the footprint of two corresponding circuit board modules in a handheld electronic device. The assembly includes top and bottom circuit board modules that are electrically interconnected through a flex circuit. Either a plate or wrapped heat spreader may be thermally coupled to the top circuit board module to conduct heat from the heat-generating components mounted to the top circuit board module and to a case of the electronic device.
Public/Granted literature
- US20110007479A1 Folded System-In-Package with Heat Spreader Public/Granted day:2011-01-13
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