Invention Grant
- Patent Title: Superconducting joint and method for manufacturing same
- Patent Title (中): 超导接头及其制造方法
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Application No.: US13188594Application Date: 2011-07-22
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Publication No.: US08385994B2Publication Date: 2013-02-26
- Inventor: Motomune Kodama , Tsuyoshi Wakuda
- Applicant: Motomune Kodama , Tsuyoshi Wakuda
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2010-165703 20100723
- Main IPC: H01L39/14
- IPC: H01L39/14

Abstract:
There is provided a superconducting joint for electrically connecting a first multifilamentary superconducting wire including a plurality of first superconducting filaments embedded in a first stabilizer matrix and a second multifilamentary superconducting wire including a plurality of second superconducting filaments embedded in a second stabilizer matrix. The joint includes: a first bundle of bare superconducting filaments being formed by removing the first stabilizer matrix at an end joint portion of the first superconducting wire; a second bundle of bare superconducting filaments being formed by removing the second stabilizer matrix at an end joint portion of the second superconducting wire; and an intermediate superconductor interposed in contact relationships between the first and the second bundles, a critical current density of the intermediate superconductor under an operating condition of the superconducting joint being less than a critical current density of the bare superconducting filaments under the operating condition.
Public/Granted literature
- US20120021915A1 SUPERCONDUCTING JOINT AND METHOD FOR MANUFACTURING SAME Public/Granted day:2012-01-26
Information query
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