Invention Grant
US08386044B2 Complex connector in component footprint of implantable medical device
有权
可植入医疗器械部件占地面积的复杂连接器
- Patent Title: Complex connector in component footprint of implantable medical device
- Patent Title (中): 可植入医疗器械部件占地面积的复杂连接器
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Application No.: US11290282Application Date: 2005-11-30
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Publication No.: US08386044B2Publication Date: 2013-02-26
- Inventor: Angela Rodgers , Andrew J. Ries , Kurt J. Casby , John D. Norton , Mark D. Breyen , Dan D. Erklouts , Brian J. Ross , Timothy T. Bomstad , Wayne L. Appleseth , Michael E. Clarke , Jeffrey L. Kehn , Scott J. Robinson
- Applicant: Angela Rodgers , Andrew J. Ries , Kurt J. Casby , John D. Norton , Mark D. Breyen , Dan D. Erklouts , Brian J. Ross , Timothy T. Bomstad , Wayne L. Appleseth , Michael E. Clarke , Jeffrey L. Kehn , Scott J. Robinson
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agent Carol F. Barry
- Main IPC: A61N1/00
- IPC: A61N1/00
Abstract:
A complex connector and component within an implantable medical device in which the complex connector is positioned within the spacing footprint of the component to optimize packaging within the device.
Public/Granted literature
- US20060172611A1 Complex connector in component footprint of implantable medical device Public/Granted day:2006-08-03
Information query
