Invention Grant
- Patent Title: Method and apparatus to design an interconnection device in a multi-layer shielding mesh
- Patent Title (中): 在多层屏蔽网中设计互连装置的方法和装置
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Application No.: US12358208Application Date: 2009-01-22
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Publication No.: US08386979B2Publication Date: 2013-02-26
- Inventor: Kenneth S. McElvain , William Halpin
- Applicant: Kenneth S. McElvain , William Halpin
- Applicant Address: US CA Mountain View
- Assignee: Synopsys, Inc.
- Current Assignee: Synopsys, Inc.
- Current Assignee Address: US CA Mountain View
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Agent Judith A. Szepesi
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
Methods and apparatuses to design an Integrated Circuit (IC) with a shielding of wires. In at least one embodiment, a shielding mesh of at least two reference voltages (e.g., power and ground) is used to reduce both the capacitive coupling and the inductive coupling in routed signal wires in IC chips. In some embodiments, a type of shielding mesh (e.g., a shielding mesh with a window surrounded by a power ring, or a window with a parser set of shielding wires) is selected to make more routing area available in locally congested areas. In other embodiments, the shielding mesh is used to create or add bypass capacitance. Other embodiments are also disclosed.
Public/Granted literature
- US20090187872A1 INTEGRATED CIRCUIT DEVICES AND METHODS AND APPARATUSES FOR DESIGNING INTEGRATED CIRCUIT DEVICES Public/Granted day:2009-07-23
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