Invention Grant
- Patent Title: Soundproof panel and soundproof structure
- Patent Title (中): 隔音面板和隔音结构
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Application No.: US13143157Application Date: 2010-01-13
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Publication No.: US08387747B2Publication Date: 2013-03-05
- Inventor: Masaru Koike , Tomoaki Kimura , Masato Iizumi
- Applicant: Masaru Koike , Tomoaki Kimura , Masato Iizumi
- Applicant Address: JP Kurashiki-shi
- Assignee: Kuraray Co., Ltd.
- Current Assignee: Kuraray Co., Ltd.
- Current Assignee Address: JP Kurashiki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2009-006138 20090114; JP2009-048437 20090302
- International Application: PCT/JP2010/050274 WO 20100113
- International Announcement: WO2010/082582 WO 20100722
- Main IPC: E04B2/02
- IPC: E04B2/02

Abstract:
A soundproof panel comprising a nonwoven structural member and a board member is prepared. The nonwoven structural member comprises a thermal adhesive fiber under moisture which is melt-bonded to a fiber of the structural member to fix the fibers. The soundproof panel may be a soundproof panel 1 comprising a nonwoven structural member 2 and a honeycomb member 3 stacked thereto. Moreover, the soundproof panel may be a soundproof panel comprising a board-like nonwoven structural member and first and second surface members stacked to first and second sides of the board-like nonwoven structural member, respectively. Further, the soundproof panel may be a soundproof panel having first and second surface members stacked through a square-pole rail member comprising a nonwoven structural member. The soundproof panel of the present invention has toughness for the lightweight design and has excellent sound absorption and sound insulation properties.
Public/Granted literature
- US20110266088A1 SOUNDPROOF PANEL AND SOUNDPROOF STRUCTURE Public/Granted day:2011-11-03
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