Invention Grant
- Patent Title: Lamp strip covering structure
- Patent Title (中): 灯条覆盖结构
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Application No.: US13014810Application Date: 2011-01-27
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Publication No.: US08388182B2Publication Date: 2013-03-05
- Inventor: Chia-Hao Chang
- Applicant: Chia-Hao Chang
- Agency: HDLS IPR Services
- Agent Chun-Ming Shih
- Priority: TW99201910U 20100129
- Main IPC: F21V21/00
- IPC: F21V21/00

Abstract:
A lamp strip covering structure includes a first lead (10), a second lead (20) (10), an insulating body (30), LEDs (40), and a thermoplastic film (50). The insulating body (50) is provided with troughs corresponding to the first lead (10) and the second lead (20), thereby uncovering a first connecting section (11) of the first lead (10) and a second connecting section (21) of the second lead (20). The LEDs (40) are electrically connected to the first connecting section (11) and the second connecting section (21). The thermoplastic film (50) wraps the LEDs (40) and the insulating body (30) to cover the LEDs (40) and the insulating body (30) due to a thermal shrinkage. By this structure, the assembly and manufacturing of the lamp strip are simplified with a reduced cost. Further, the electrical connection between the LED (40) and the leads (10, 20) is maintained.
Public/Granted literature
- US20110188248A1 LAMP STRIP COVERING STRUCTURE Public/Granted day:2011-08-04
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