Invention Grant
- Patent Title: Illumination device with heat dissipation structures
- Patent Title (中): 具有散热结构的照明装置
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Application No.: US12824208Application Date: 2010-06-27
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Publication No.: US08388195B2Publication Date: 2013-03-05
- Inventor: Cheng-Tien Lai , Chi-Yuan Lai , Zhi-Yong Zhou
- Applicant: Cheng-Tien Lai , Chi-Yuan Lai , Zhi-Yong Zhou
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201010146693 20100414
- Main IPC: B60Q1/06
- IPC: B60Q1/06 ; B60Q1/26 ; F21V29/00

Abstract:
An exemplary illumination device includes an enclosure, a semiconductor light source accommodated in the enclosure, and an envelope engaged with the enclosure and covering the semiconductor light source. Light generated by the semiconductor light source can project through the envelope and out of the illumination device. The semiconductor light source includes a plurality of light source modules independent from each other. A plurality of air passages are defined in each light source module for air passing therethrough to dissipate heat generated by the semiconductor light source into ambient air.
Public/Granted literature
- US20110255285A1 ILLUMINATION DEVICE WITH HEAT DISSIPATION STRUCTURES Public/Granted day:2011-10-20
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