Invention Grant
- Patent Title: Evaporation source and vapor deposition apparatus using the same
- Patent Title (中): 蒸发源和使用其的蒸镀装置
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Application No.: US12771258Application Date: 2010-04-30
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Publication No.: US08388756B2Publication Date: 2013-03-05
- Inventor: Sheng-Lai Lin
- Applicant: Sheng-Lai Lin
- Applicant Address: CN Shenzhen HK Kowloon
- Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee Address: CN Shenzhen HK Kowloon
- Agency: Altis Law Group, Inc.
- Priority: CN200910307692 20090925
- Main IPC: C23C16/44
- IPC: C23C16/44
Abstract:
An evaporation source that causes the evaporation bars to vaporize and emit small particles. The small particles of the evaporation bars are evenly dispersed all around the evaporation source. Thus, the particles then accumulate on workpieces to form symmetrical films. A vapor deposition apparatus using the present evaporation source is also described.
Public/Granted literature
- US20110076398A1 EVAPORATION SOURCE AND VAPOR DEPOSITION APPARATUS USING THE SAME Public/Granted day:2011-03-31
Information query
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