Invention Grant
- Patent Title: Handler attachment for integrated circuit fabrication
- Patent Title (中): 集成电路制造的处理器附件
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Application No.: US12788832Application Date: 2010-05-27
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Publication No.: US08388782B2Publication Date: 2013-03-05
- Inventor: Paul S. Andry , Bing Dang , John Knickerbocker , Aparna Prahbakar , Peter J. Sorce , Robert E. Trzcinski , Cornelia K. Tsang
- Applicant: Paul S. Andry , Bing Dang , John Knickerbocker , Aparna Prahbakar , Peter J. Sorce , Robert E. Trzcinski , Cornelia K. Tsang
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Louis Percello
- Main IPC: B32B38/10
- IPC: B32B38/10 ; B32B37/12
Abstract:
A method for attaching a handler to a wafer, the wafer comprising an integrated circuit (IC), includes forming a layer of an adhesive on the wafer, the adhesive comprising a polyimide-based polymer configured to withstand processing at a temperature of over about 280° C.; and adhering a handler to the wafer using the layer of adhesive. A system for attaching a handler to a wafer, the wafer comprising IC, includes a layer of an adhesive located on the wafer, the adhesive comprising a polyimide-based polymer configured to withstand processing at a temperature of over about 280° C.; and a handler adhered to the wafer using the layer of adhesive.
Public/Granted literature
- US20110290402A1 Handler Attachment for Integrated Circuit Fabrication Public/Granted day:2011-12-01
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