Invention Grant
US08388792B2 Nonstick material, method for removing a part of a planar material layer and multilayer structure and use therefor
有权
不粘材料，用于去除一部分平面材料层的方法和多层结构并用于其
- Patent Title: Nonstick material, method for removing a part of a planar material layer and multilayer structure and use therefor
- Patent Title (中): 不粘材料，用于去除一部分平面材料层的方法和多层结构并用于其
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Application No.: US12449606Application Date: 2008-01-30
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Publication No.: US08388792B2Publication Date: 2013-03-05
- Inventor: Gerald Weidinger , Günther Weichslberger , Markus Leitgeb , Johannes Stahr
- Applicant: Gerald Weidinger , Günther Weichslberger , Markus Leitgeb , Johannes Stahr
- Applicant Address: AT Leoben-Hinterberg
- Assignee: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Current Assignee: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Current Assignee Address: AT Leoben-Hinterberg
- Agency: Jacobson Holman PLLC
- Priority: ATGM100/2007 20070216; ATGM727/2007 20071203
- International Application: PCT/AT2008/000029 WO 20080130
- International Announcement: WO2008/098271 WO 20080821
- Main IPC: B32B37/26
- IPC: B32B37/26 ; B32B38/10 ; B32B38/04 ; C08J5/16 ; C09J5/02 ; B29C63/48
Abstract:
The invention relates to a nonstick material for use during removal of a part (11) of a substantially planar material layer (2) which is connected in a connecting step to at least on further, substantially planar material layer (9). According to the invention, the nonstick material (8) has a different polarity than the adjoining, substantially planar material layers (2, 9). The invention also relates to a method for removing a part (11) of a substantially planar material layer (2) which is connected in a connecting step to at least one further, substantially planar material layer (9), to a multilayer structure which consists of at least two substantially planar material layers (2, 9) to be interconnected, and to a use of the same, especially in a multilayer printed circuit board.
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