Invention Grant
- Patent Title: Composition for forming polishing layer of chemical mechanical polishing pad, chemical mechanical polishing pad and chemical mechanical polishing method
- Patent Title (中): 用于形成化学机械抛光垫抛光层，化学机械抛光垫和化学机械抛光方法的组合物
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Application No.: US12357706Application Date: 2009-01-22
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Publication No.: US08388799B2Publication Date: 2013-03-05
- Inventor: Rikimaru Kuwabara , Takahiro Okamoto , Yukio Hosaka , Takafumi Shimizu , Tsuyoshi Watanabe
- Applicant: Rikimaru Kuwabara , Takahiro Okamoto , Yukio Hosaka , Takafumi Shimizu , Tsuyoshi Watanabe
- Applicant Address: JP Tokyo
- Assignee: JSR Corporation
- Current Assignee: JSR Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-014115 20080124; JP2008-134238 20080522
- Main IPC: H01L21/304
- IPC: H01L21/304 ; C08G18/42 ; C08G18/48 ; C08G18/62
Abstract:
A composition for forming a chemical mechanical polishing pad having polishing characteristics such as a high polishing rate, an excellent planarity of the polished object, and less scratches of the polished object. The composition includes (A) a polyurethane having a carbon-carbon double bond on a side chain and (B) a cross-linking agent. The polyurethane (A) is preferably a thermoplastic polyurethane (A′) obtained by mixing at least components (a11) to (a13) and component (a2) in a proportion satisfying the following conditions (1) and (2) and reacting them.
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