Invention Grant
- Patent Title: Method for fabricating touch sensor panels
- Patent Title (中): 制造触摸传感器面板的方法
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Application No.: US12848049Application Date: 2010-07-30
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Publication No.: US08388852B2Publication Date: 2013-03-05
- Inventor: Lili Huang , Siddharth Mohapatra , John Z. Zhong
- Applicant: Lili Huang , Siddharth Mohapatra , John Z. Zhong
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Morrison & Foerster LLP
- Main IPC: B44C1/22
- IPC: B44C1/22

Abstract:
A method for fabricating a touch sensor panel is disclosed. The method includes providing a substrate for the touch sensor panel, depositing a conductive material layer on a top surface of the substrate, depositing a metal layer on top of the conductive material layer, affixing a resist to a first area of the metal layer, the resist also adapted to serve as a passivation layer during passivation, removing metal from the metal layer outside of the first area; and performing passivation on the substrate while leaving the affixed resist intact.
Public/Granted literature
- US20120024816A1 METHOD FOR FABRICATING TOUCH SENSOR PANELS Public/Granted day:2012-02-02
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